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  june 2005 asm2p2309nz rev 0.2 alliance semiconductor 2575, augustine drive ? santa clara, ca ? tel: 408.855.4900 ? fax: 408.855.4999 ? www.alsc.com notice: the information in this document is subject to change without notice. nine output 3.3v buffer features ? one-input to nine-output buffer/driver ? supports two dimms or four so-dimms with one additional output for feedback to an external or chipset pll ? low power consumption for mobile applications less than 32 ma at 66.6 mhz with unloaded outputs ? 1ns input-output delay ? buffers all frequencies from dc to 133.33 mhz ? output-output skew less than 250ps ? multiple v dd and v ss pins for noise and electromagnetic interference (emi) reduction ? space-saving 16-pin 150-mil soic package ? 3.3v operation ? commercial and industrial temperature parts are available functional description the asm2p2309nz is a low-cost buffer designed to distribute high-speed clocks in mobile pc systems and desktop pc systems with sdram support. the part has nine outputs, eight of which can be used to drive two dimms or four so-dimms, and the remaining can be used for external feedback to a pll. the device operates at 3.3v and outputs can run up to 133.33 mhz. the asm2p2309nz is designed for low emi and power optimization. it has multiple v ss and v dd pins for noise optimization and consumes less than 32 ma at 66.6 mhz, making it ideal for the low-power requirements of mobile systems. it is available in an ultra-compact 150-mil 16-pin soic package. block diagram
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 2 of 9 notice: the information in this document is subject to change without notice. pin configuration for asm2p2309nz pin description for asm2p2309nz pin signal description 4, 8, 13 v dd 3.3v digital voltage supply 5, 9, 12 gnd ground 1 buf_in input clock 2, 3, 6, 7, 10, 11, 14, 15, 16 output [1:9] outputs
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 3 of 9 notice: the information in this document is subject to change without notice. absolute maximum ratings parameter min max unit supply voltage to ground potential -0.5 7.0 v dc input voltage (except ref) -0.5 v dd + 0.5 v dc input voltage (ref) -0.5 0.7 v storage temperature -65 +150 c junction temperature 150 c static discharge voltage (as per jedec std 22- a114-b) >2000 v note: these are stress ratings only and functional usage is not implied. exposure to absolute maximum ratings for prolonged per iods can affect device reliability. operating conditions parameter description min max unit v dd supply voltage 3.0 3.6 v (ambient operating temperature), commercial 0 70 c t a (ambient operating temper ature), industrial ?40 85 c load capacitance, fout < 100 mhz - 30 pf c l load capacitance,100 mhz < fout < 133.33 mhz - 15 pf c in input capacitance - 7 pf buf_in, output [1:9] operating frequency dc 133.33 mhz t pu power-up time for all v dd 's to reach minimum specified voltage (power ramps must be monotonic) 0.05 50 ms
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 4 of 9 notice: the information in this document is subject to change without notice. electrical characteristics for commercial and industrial temperature devices parameter description test conditions min. max. unit v il input low voltage 1 - 0.8 v v ih input high voltage 1 2.0 - v i il input low current v in = 0v - 50.0 a i ih input high current v in = v dd - 100.0 a v ol output low voltage 2 i ol = 8 ma - 0.4 v v oh output high voltage 2 i oh = ?8 ma 2.4 - v i dd supply current unloaded outputs at 66.66 mhz - 32 ma switching characteristics for commercial and industrial temperature devices 3 parameter name description min. typ. max. unit t d duty cycle 2 = t 2 t 1 measured at 1.4v 40.0 50.0 60.0 % t 3 rise time 2 measured between 0.8v and 2.0v - - 1.50 ns t 4 fall time 2 measured between 0.8v and 2.0v - - 1.50 ns t 5 output to output skew 2 all outputs equally loaded - - 250 ps t 6 propagation delay, buf_in rising edge to output rising edge 2 measured at v dd /2 1 5 9.2 ns note: 1. buf_in input has a threshold voltage of v dd /2. 2. parameter is guaranteed by design and characteri zation. it is not 100% tested in production. 3. all parameters specified with loaded outputs.
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 5 of 9 notice: the information in this document is subject to change without notice. switching waveforms duty cycle timing all outputs rise/fall time output-output skew input-output propagation delay
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 6 of 9 notice: the information in this document is subject to change without notice. test circuits
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 7 of 9 notice: the information in this document is subject to change without notice. package information 16-lead (150 mil) molded soic package e h a a1 a2 d e b l c h seating plane d 0.004 pi n 1 id 1 8 916 dimensions inches millimeters symbol min max min max a 0.053 0.069 1.35 1.75 a1 0.004 0.010 0.10 0.25 a2 0.049 0.059 1.25 1.50 b 0.013 0.022 0.33 0.53 c 0.008 0.012 0.19 0.27 d 0.386 0.394 9.80 10.01 e 0.150 0.157 3.80 4.00 e 0.050 bsc 1.27 bsc h 0.228 0.244 5.80 6.20 h 0.010 0.016 0.25 0.41 l 0.016 0.035 0.40 0.89 0 8 0 8
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 8 of 9 notice: the information in this document is subject to change without notice. ordering codes part number marking package type operating range asm5p2309nzf-08-st 5p2309nzf 16-pin 150-mil soic, pb free commercial asm5p2309nzf-08-sr 5p2309nzf 16-pin 150-mil soic, tape and reel, pb free commercial ASM5I2309NZf-08-st 5i2309nzf 16-pin 150-mil soic, pb free industrial ASM5I2309NZf-08-sr 5i2309nzf 16-pin 150-m il soic, tape and reel, pb free industrial asm5p2309nzg-08-st 5p2309nzg 16-pin 150-mil soic, green commercial asm5p2309nzg-08-sr 5p2309nzg 16-pin 150-mil soic, tape and reel, green commercial ASM5I2309NZg-08-st 5i2309nzg 16-pi n 150-mil soic, green industrial ASM5I2309NZg-08-sr 5i2309nzg 16-pin 150 -mil soic ,tape and reel, green industrial device ordering information asm2p2309nz f-16-sr licensed under us patent #5,488, 627, #6,646,463 and #5,631,920. o = sot u = msop s = soic e = tqfp t = tssop l = lqfp a = ssop u = msop v = tvsop p = pdip b = bga d = qsop q = q fn x = sc-70 device pin count x= automotive i= industrial p or n/c = commercial (-40c to +125c) (-40c to +85c) (0c to +70c) 1 = reserved 6 = power management 2 = non pll based 7 = power management 3 = emi reduction 8 = power management 4 = ddr support products 9 = hi performance 5 = std zero dela y buffer 0 = reserved alliance semiconductor mixed signal product part number f = lead free and rohs compliant part g = green package r = tape & reel, t = tube or tray
june 2005 asm2p2309nz rev 0.2 nine output 3.3v buffer 9 of 9 notice: the information in this document is subject to change without notice. ? copyright 2003 alliance semiconductor corporation. all rights reserved. our three-point logo, our name and intelliwatt are trademarks or registered trademarks of alliance. all other brand and product names may be the trademarks of their respective companies. alliance reserves the right to make ch anges to this document and its products at any time without notice. alliance assumes no responsibility for any errors t hat may appear in this document. the data contained herein represents alliance's best data and/or estimate s at the time of issuance. alliance rese rves the right to change or correct this data at any time, without notice. if the product described herein is under development, significant changes to these specifications are possible. the information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. alliance does not assume any responsibility or lia bility arising out of the applic ation or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of alliance products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in alliance's terms and conditions of sale (which are available from alliance). all sales of alliance products are made exclusively according to alliance's terms and conditions of sale. the purchase of products from alliance does not convey a license under any pa tent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of alli ance or third parties. alliance does not aut horize its products for use as critical components in life-supporting systems where a malfunction or fa ilure may reasonably be expected to result in significant injury to the user, and the inclusion of alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify alliance against all claims arising from such use. alliance semiconductor corporation 2575, augustine drive, santa clara, ca 95054 tel# 408-855-4900 fax: 408-855-4999 www.alsc.com copyright ? alliance semiconductor all rights reserved part number: asm2p2309nz document version: 0.2 note: this product utilizes us patent # 6,646,463 impedance emulator patent issued to alliance semiconductor, dated 11-11-2003


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